BASF Ultramid® A3WG10 HP BK23325

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ULTRAMID A3WG10 HP BK23325 Heat-aging Stabilized PA66-GF50

Ultramid® A3WG10 HP BK23325 is BASF’s 50% glass fibre reinforced PA66. It delivers very high rigidity, with a tensile modulus of 17,000 MPa. HDT/A reaches 255 °C for demanding heat loads. The HP stabilizer package ensures long-term heat-aging resistance. Ideal for structural, under-the-hood, and E/E parts.

Associated Documents

TDS - Data Sheet
MSDS - Safety Data Sheet
TDS - Data Sheet

Typical property data

Physical Properties
  • Polymer Base: PA66-GF50 (Ultramid® A3WG10 HP BK23325)
  • Density: 1570 kg/m³ (ISO 1183)
  • Viscosity Number (0.5% in 96% H₂SO₄): 123 cm³/g (ISO 307 / 1157 / 1628)
  • Moisture Absorption, equilibrium 23 °C / 50% r.h.: 1.25 % (similar to ISO 62)
  • Water Absorption, saturation in water at 23 °C: 4.3 % (similar to ISO 62)
  • Bulk Density (granules): approx. 0.7 g/cm³
  • Colour: Black (BK23325)
Mechanical Properties
  • Tensile Modulus: 17 000 / 12 900 MPa (ISO 527-1/-2) — very high rigidity
  • Stress at Break: 250 / 180 MPa (ISO 527-1/-2)
  • Strain at Break: 2.5 / 3.4 % (ISO 527-1/-2)
  • Tensile Creep Modulus, 1000 h, ε ≤ 0.5 %, 23 °C: — / 10 000 MPa (ISO 899-1)
  • Flexural Modulus: 15 600 / 12 500 MPa (ISO 178)
  • Flexural Strength: 380 / 285 MPa (ISO 178)
  • Charpy Unnotched Impact Strength (+23 °C): 100 / 100 kJ/m² (ISO 179/1eU)
  • Charpy Unnotched Impact Strength (−30 °C): 90 / 90 kJ/m² (ISO 179/1eU)
  • Charpy Notched Impact Strength (+23 °C): 16 / 20 kJ/m² (ISO 179/1eA)
  • Charpy Notched Impact Strength (−30 °C): 15 / 15 kJ/m² (ISO 179/1eA)
Thermal Properties
  • Melting Temperature (DSC): 260 °C (ISO 11357-1/-3)
  • HDT/A (1.8 MPa): 255 °C (ISO 75-1/-2) — outstanding heat resistance
  • HDT/B (0.45 MPa): 262 °C (ISO 75-1/-2)
  • CLTE, longitudinal (23–55 °C): 20 E-6/K (ISO 11359-1/-2)
  • CLTE, transverse (23–55 °C): 75 E-6/K (ISO 11359-1/-2)
  • Heat-aging Resistance: Yes — HP (Heat Performance) stabilization package
Electrical Properties
  • Relative Permittivity (1 MHz): 4.3 / 5.1 (IEC 62631-2-1)
  • Dissipation Factor (1 MHz): 117 / 690 × 10⁻⁴ (IEC 62631-2-1)
  • Volume Resistivity: 2 × 10¹² / 8 × 10⁸ Ω·m (IEC 62631-3-1)
  • Surface Resistivity: — / 3 × 10¹³ Ω (IEC 62631-3-2)
  • Comparative Tracking Index (CTI), test liquid A: — / 600 (IEC 60112) — top PLC 0 class
Processing Parameters
  • MVR 275 °C / 5 kg: 12 cm³/10 min (ISO 1133)
  • Melt Temperature Range (Injection / Extrusion): 290 – 310 °C
  • Recommended Melt Temperature: 300 °C
  • Mould Temperature Range: 80 – 100 °C
  • Recommended Mould Temperature: 100 °C
  • Moulding Shrinkage, constrained: 0.38 % (TM = 290 °C, TW = 80 °C)
  • Moulding Shrinkage, parallel: 0.34 % (ISO 294-4)
  • Moulding Shrinkage, normal: 0.85 % (ISO 294-4)
  • Flowability, Spiral Flow Length (d = 2.0 mm): 33 cm (BASF method)
  • Pre-drying Temperature: 80 °C
  • Pre-drying Time: 4 h

Use & Applications

  • for structural & under-the-hood parts.
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