Covestro Bayblend® T85 HG PC/ABS
Plastic Granules
Bayblend® T85 HG PC/ABS Resin
Bayblend T85 HG by Covestro is an easy-flow PC/ABS blend engineered for high-gloss finishes and brilliant colors. With exceptional impact resistance (even at -30°C) and heat resistance (Vicat 130°C), it’s ideal for demanding injection-molded parts requiring durability and aesthetic appeal.
Typical property data
Physical Properties (Rheological)
- Melt volume-flow rate: 17 cm³/10 min (260 °C/5 kg, ISO 1133)
- Melt viscosity: 260 Pa·s (1000 s⁻¹/260 °C, ISO 11443-A)
- Molding shrinkage (parallel/normal): 0.55–0.75% (ISO 294-4)
Mechanical Properties (23 °C/50 % r.h.)
- Tensile modulus: 2250 MPa (1 mm/min, ISO 527-1,-2)
- Yield stress: 55 MPa (50 mm/min, ISO 527-1,-2)
- Yield strain: 5.0% (50 mm/min, ISO 527-1,-2)
- Stress at break: 54 MPa (50 mm/min, ISO 527-1,-2)
- Strain at break: >50% (ISO 527-1,-2)
- Izod notched impact strength (23 °C): 49 kJ/m² (ISO 180/A)
- Izod notched impact strength (-30 °C): 34 kJ/m² (ISO 180/A)
- Puncture energy (23 °C): 46 J (ISO 6603-2)
- Puncture energy (-30 °C): 52 J (ISO 6603-2)
Thermal Properties
- Deflection temperature under load (1.80 MPa): 108 °C (ISO 75-1,-2)
- Deflection temperature under load (0.45 MPa): 126 °C (ISO 75-1,-2)
- Vicat softening temperature (50 N, 50 °C/h): 128 °C (ISO 306)
- Vicat softening temperature (50 N, 120 °C/h): 130 °C (ISO 306)
- Coefficient of linear thermal expansion (parallel): 0.70 × 10⁻⁴/K (ISO 11359-1,-2)
- Coefficient of linear thermal expansion (normal): 0.75 × 10⁻⁴/K (ISO 11359-1,-2)
- Burning behavior: UL 94 HB (0.85 mm thickness, UL 94 standard)
Electrical Properties (23 °C/50 % r.h.)
- Relative permittivity (100 Hz): 3.0 (IEC 60250)
- Relative permittivity (1 MHz): 2.9 (IEC 60250)
- Dissipation factor (100 Hz): 20 × 10⁻⁴ (IEC 60250)
- Dissipation factor (1 MHz): 90 × 10⁻⁴ (IEC 60250)
- Volume resistivity: 1 × 10¹⁴ Ohm·m (IEC 62631-3-1)
- Surface resistivity: 1 × 10¹⁶ Ohm (IEC 62631-3-2)
- Electrical strength: 35 kV/mm (1 mm, IEC 60243-1)
- Comparative Tracking Index (CTI): 225 (Solution A, IEC 60112)
Other Properties (23 °C)
- Water absorption (saturation): 0.7% (ISO 62)
- Water absorption (equilibrium): 0.2% (23 °C, 50% r.h., ISO 62)
- Density: 1140 kg/m³ (ISO 1183-1)
Processing and Drying Conditions
- Injection molding melt temperature: 260–280 °C (Standard: 270 °C, ISO 294)
- Mold temperature: 70–90 °C (ISO 294)
- Injection velocity: 240 mm/s (ISO 294)
- Drying temperature: 95–110 °C (Dry air, 4 hours)
- Moisture content (max): ≤ 0.02%
Features & Benefits
Easy-Flow for Complex Molds
The low melt viscosity (260 Pa·s) ensures smooth filling of intricate designs, reducing defects like sink marks and shortening cycle times for high-volume production.
Stunning Aesthetics, Zero Paint Needed
It achieves mirror-like gloss and vibrant colors without post-processing—saving costs on painting while delivering premium consumer-ready surfaces.
Toughness Meets Heat Resistance
It withstands impacts (49 kJ/m² at 23°C) and thermal stress (HDT 108°C at 1.8 MPa), ensuring reliability in automotive interiors or electronics exposed to harsh conditions.
Use & Applications
- Automotive: Glossy trim, dashboard panels, and interior controls.
- Electronics: Smartphone/laptop housings, buttons, and high-visibility covers.
- Consumer Goods: Appliance casings, power-tool bodies, and premium packaging.
- Industrial: Durable enclosures and components requiring color stability.