Covestro Bayblend® T90 XG PC/ABS
Bayblend® T90 XG PC/ABS Resin
Covestro PC/ABS Bayblend T90 XG is an advanced polymer PC/ABS blend. Ideal for injection molding, this easy-flowing resin delivers exceptional impact resistance, heat stability, and flawless metallization-ready surfaces. Perfect for automotive, electronics, and industrial components.
Typical property data
Physical Properties (Rheological)
- Melt volume-flow rate: 26 cm³/10 min (260 °C/5 kg, ISO 1133)
- Melt viscosity: 225 Pa·s (1000 s⁻¹/260 °C, ISO 11443-A)
- Molding shrinkage, parallel: 0.55–0.75% (60x60x2 mm³/260 °C/MT 80 °C, ISO 294-4)
- Molding shrinkage, normal: 0.55–0.75% (60x60x2 mm³/260 °C/MT 80 °C, ISO 294-4)
Mechanical Properties (23 °C/50% r. h.)
- Tensile modulus: 2400 MPa (1 mm/min, ISO 527-1,-2)
- Yield stress: 61 MPa (50 mm/min, ISO 527-1,-2)
- Yield strain: 5.1% (50 mm/min, ISO 527-1,-2)
- Stress at break: 56 MPa (50 mm/min, ISO 527-1,-2)
- Strain at break: >50% (50 mm/min, ISO 527-1,-2)
- Izod notched impact strength (23 °C): 52 kJ/m² (ISO 180/A)
- Izod notched impact strength (-30 °C): 18 kJ/m² (ISO 180/A)
- Puncture energy (23 °C): 51 J (ISO 6603-2)
- Puncture energy (-30 °C): 57 J (ISO 6603-2)
Thermal Properties
- Temperature of deflection under load (1.80 MPa): 112 °C (ISO 75-1,-2)
- Temperature of deflection under load (0.45 MPa): 130 °C (ISO 75-1,-2)
- Vicat softening temperature (50 N; 50 °C/h): 134 °C (ISO 306)
- Vicat softening temperature (50 N; 120 °C/h): 135 °C (ISO 306)
- Coefficient of linear thermal expansion: 0.70 x 10⁻⁴/K (23 to 55 °C, parallel and normal, ISO 11359-1,-2)
Electrical Properties (23 °C/50% r. h.)
- Relative permittivity (100 Hz): 3.1 (IEC 60250)
- Relative permittivity (1 MHz): 3.0 (IEC 60250)
- Dissipation factor (100 Hz): 25 x 10⁻⁴ (IEC 60250)
- Dissipation factor (1 MHz): 100 x 10⁻⁴ (IEC 60250)
- Volume resistivity: 1E14 Ohm·m (IEC 62631-3-1)
- Surface resistivity: 1E16 Ohm (IEC 62631-3-2)
- Electrical strength: 35 kV/mm (1 mm, IEC 60243-1)
Electrical Properties (23 °C/50% r. h.)
- Relative permittivity (100 Hz): 3.1 (IEC 60250)
- Relative permittivity (1 MHz): 3.0 (IEC 60250)
- Dissipation factor (100 Hz): 25 x 10⁻⁴ (IEC 60250)
- Dissipation factor (1 MHz): 100 x 10⁻⁴ (IEC 60250)
- Volume resistivity: 1E14 Ohm·m (IEC 62631-3-1)
- Surface resistivity: 1E16 Ohm (IEC 62631-3-2)
- Electrical strength: 35 kV/mm (1 mm, IEC 60243-1)
Other Properties (23 °C)
- Water absorption (saturation value): 0.5% (Water at 23 °C, ISO 62)
- Water absorption (equilibrium value): 0.2% (23 °C; 50% r. h., ISO 62)
- Density: 1150 kg/m³ (ISO 1183-1)
Processing and Drying Conditions
- Injection molding – Melt temperature: 260 °C (ISO 294)
- Injection molding – Mold temperature: 80 °C (ISO 294)
- Injection molding – Injection velocity: 240 mm/s (ISO 294)
- Recommended melt temperatures: 260–280 °C
- Dry air drying temperature: 95–110 °C
- Dry air drying time: 4 hours
- Moisture content (max.): ≤0.02%
Features & Benefits
Effortless High-Precision Molding
With a melt flow rate of 26 cm³/10 min (260°C/5kg), Bayblend® T90 XG fills intricate molds smoothly, reducing cycle times and minimizing defects like sink marks. Benefit: Lower production costs and higher yield for complex parts like thin-walled electronics housings.
Premium Metallization Surface Finish
Optimized for steam treatment, it ensures uniform metal adhesion without surface flaws. *Benefit: Eliminates post-processing for automotive grilles or consumer electronics, cutting time-to-market by 30%.
Reliable Impact & Heat Resilience
It maintains strength at -30°C (18 kJ/m² notched impact) and resists deformation up to 135°C. Benefit: Trusted for under-hood automotive parts or outdoor equipment exposed to thermal shocks.
Use & Applications
- Automotive: HVAC vents, mirror housings, chrome-plated trims.
- Electronics: Laptop bezels, wearables, connector housings.
- Industrial: Power tool casings, medical device components.
- Consumer Goods: Appliance panels, premium cosmetic packaging.