Covestro Bayblend® M303 FR PC/ABS
Plastic Granules
Bayblend® M303 FR PC/ABS Resin Flame Retardant
Bayblend M303 FR is a flame-retardant (PC+ABS) blend engineered for high-impact electrical/electronic components and limited-skin-contact medical devices. It offers a Vicat rating of 115°C and is manufactured under strict GMP standards.
Associated Documents
ISO TDS
Typical property data
Physical Properties (Rheological)
- Melt Volume-Flow Rate (260 °C, 5 kg): 11 cm³/10 min (ISO 1133)
- Melt Viscosity (1000 s⁻¹, 260 °C): 410 Pa·s (ISO 11443-A)
- Molding Shrinkage (Parallel/Normal): 0.5–0.7% (ISO 2577)
Mechanical properties (23 °C/50 % r. h.)
- Tensile Modulus: 2650 MPa (ISO 527-1,-2)
- Yield Stress: 69 MPa (ISO 527-1,-2)
- Yield Strain: 5% (ISO 527-1,-2)
- Nominal Strain at Break: >50% (ISO 527-1,-2)
- Stress at Break: 53 MPa (ISO 527-1,-2)
- Izod Notched Impact Strength (23 °C): 40 kJ/m² (ISO 180/A)
- Izod Notched Impact Strength (-30 °C): 10 kJ/m² (ISO 180/A)
Thermal Properties
- Deflection Temperature Under Load (1.80 MPa): 98 °C (ISO 75-1,-2)
- Deflection Temperature Under Load (0.45 MPa): 106 °C (ISO 75-1,-2)
- Vicat Softening Temperature (50 N, 120 °C/h): 115 °C (ISO 306)
- Coefficient of Linear Thermal Expansion (Parallel, 23–55 °C): 0.68 × 10⁻⁴/K (ISO 11359-1,-2)
- Coefficient of Linear Thermal Expansion (Normal, 23–55 °C): 0.72 × 10⁻⁴/K (ISO 11359-1,-2)
Electrical properties (23 °C/50 % r. h.)
- Relative Permittivity (100 Hz): 3.2 (IEC 60250)
- Relative Permittivity (1 MHz): 3.1 (IEC 60250)
- Dissipation Factor (100 Hz): 3.7 × 10⁻³ (IEC 60250)
- Dissipation Factor (1 MHz): 7.5 × 10⁻³ (IEC 60250)
- Volume Resistivity: 1 × 10¹⁵ Ω·m (IEC 62631-3-1)
- Surface Resistivity: 1 × 10¹⁷ Ω (IEC 62631-3-2)
- Electrical Strength: 35 kV/mm (IEC 60243-1)
Other Properties (23 °C)
- Density: 1190 kg/m³ (ISO 1183-1)
- Water Absorption (Saturation Value): 0.5% (ISO 62)
Processing and Drying Conditions
- Melt Temperature: 240–270 °C (Standard: 260 °C)
- Barrel Temperatures:
- Rear: 220–230 °C
- Middle: 225–235 °C
- Front: 230–240 °C
- Nozzle: 255–265 °C
- Mold Temperature: 60–90 °C
- Hold Pressure (% of Injection Pressure): 50–75%
- Back Pressure (Specific): 50–150 bar
- Peripheral Screw Speed: 0.05–0.2 m/s
- Shot-to-Cylinder Size: 30–70%
- Dry Air Drying Temperature: 80 °C
- Dry Air Drying Time: 4 hours
- Moisture Content (Max): ≤0.02%
- Vent Depth: 0.025–0.075 mm
Features & Benefits
Superior Flame Retardancy & Safety
It achieves a UL 94 V-0 rating at 1.5mm, ensuring critical fire safety and compliance for enclosures and internal components in consumer electronics and office equipment.
Exceptional Impact Strength & Durability
It offers high notched impact strength, providing outstanding toughness and resistance to drops and impacts, which reduces breakage and extends product lifespan.
Excellent Processability & Efficiency
It features a balanced melt flow for easy injection molding, allowing for fast cycle times, complex geometries, and high-quality surface finishes, boosting manufacturing productivity.
Use & Application
- Electrical and Electronic Device Housings: Printer, laptop, and monitor enclosures.
- Internal Electrical Components: Connectors, sockets, and circuit breakers.
- Office and Consumer Equipment: Housings for power strips, chargers, and small appliances.
- Medical Device Housings: e.g., external diagnostic equipment housings.
- Injection Molding: processing method for high-volume production of complex parts.
- Extrusion: Can be used for creating specific profiles or sheets.