Covestro Bayblend® T85 XF RE PC/ABS
Plastic Granules
Bayblend® T85 XF RE PC/ABS Extra Flow Grade
Bayblend T85 XF RE is a high-flow, impact-resistant PC/ABS blend from Covestro, featuring enhanced heat stability (Vicat 130°C) and bio-circular content via ISCC PLUS mass balance. Ideal for demanding injection molding applications, it combines sustainability with rugged performance.
Associated Documents
ISO TDS
Typical property data
Physical Properties (Rheological)
- Melt volume-flow rate: 19 cm³/10 min (260 °C/5 kg, ISO 1133)
- Melt viscosity: 250 Pa·s (1000 s⁻¹/260 °C, ISO 11443-A)
- Molding shrinkage (parallel): 0.6–0.75% (60x60x2 mm³/260 °C/MT 80 °C/500 bar, ISO 294-4)
- Molding shrinkage (normal): 0.6–0.75% (60x60x2 mm³/260 °C/MT 80 °C/500 bar, ISO 294-4)
Mechanical Properties (23 °C/50% r.h.)
- Tensile modulus: 2300 MPa (1 mm/min, ISO 527-1,-2)
- Yield stress: 54 MPa (50 mm/min, ISO 527-1,-2)
- Yield strain: 4.7% (50 mm/min, ISO 527-1,-2)
- Stress at break: 50 MPa (50 mm/min, ISO 527-1,-2)
- Strain at break: >50% (50 mm/min, ISO 527-1,-2)
- Izod notched impact strength (23 °C): 48 kJ/m² (ISO 180/A)
- Izod notched impact strength (-30 °C): 35 kJ/m² (ISO 180/A)
- Charpy notched impact strength (23 °C): 50 kJ/m² (ISO 179/1eA)
- Charpy notched impact strength (-30 °C): 37 kJ/m² (ISO 179/1eA)
Thermal Properties
- Temperature of deflection under load (1.80 MPa): 107 °C (ISO 75-1,-2)
- Temperature of deflection under load (0.45 MPa): 126 °C (ISO 75-1,-2)
- Vicat softening temperature (50 N, 50 °C/h): 128 °C (ISO 306)
- Vicat softening temperature (50 N, 120 °C/h): 130 °C (ISO 306)
- Coefficient of linear thermal expansion (parallel): 0.75 x 10⁻⁴/K (23–55 °C, ISO 11359-1,-2)
- Coefficient of linear thermal expansion (normal): 0.8 x 10⁻⁴/K (23–55 °C, ISO 11359-1,-2)
- Burning behavior: UL 94 HB (0.85 mm, UL 94)
- Oxygen index: 24% (ISO 4589-2)
Electrical Properties (23 °C/50% r.h.)
- Relative permittivity (100 Hz): 3.1 (IEC 60250)
- Relative permittivity (1 MHz): 3.0 (IEC 60250)
- Dissipation factor (100 Hz): 20 x 10⁻⁴ (IEC 60250)
- Dissipation factor (1 MHz): 85 x 10⁻⁴ (IEC 60250)
- Volume resistivity: 1 x 10¹⁴ Ohm·m (IEC 62631-3-1)
- Surface resistivity: 1 x 10¹⁶ Ohm (IEC 62631-3-2)
- Electrical strength: 35 kV/mm (1 mm, IEC 60243-1)
- Comparative tracking index (CTI): 225 (Solution A, IEC 60112)
Other Properties (23 °C)
- Water absorption (saturation value): 0.7% (Water at 23 °C, ISO 62)
- Water absorption (equilibrium value): 0.2% (23 °C, 50% r.h., ISO 62)
- Density: 1140 kg/m³ (ISO 1183-1)
Processing and Drying Conditions
- Melt temperature: 260–280 °C (Standard: 270 °C, ISO 294)
- Mold temperature: 70–90 °C (ISO 294)
- Injection velocity: 240 mm/s (ISO 294)
- Hold pressure: 50–75% of injection pressure
- Plastic back pressure: 50–150 bar
- Dry air drying temperature: 95–110 °C
- Dry air drying time: 4 hours
- Moisture content (max): ≤ 0.02%
- Vent depth: 0.025–0.075 mm
Features & Benefits
Enhanced Flow for Complex Molds
With superior melt fluidity (19 cm³/10min), T85 XF RE fills intricate designs effortlessly, reducing cycle times and minimizing defects in thin-walled parts like electronics housings.
Impact Resistance Under Stress
It boasts 50 kJ/m² Charpy notched impact strength, ensuring parts withstand drops or impacts—perfect for automotive trim or rugged industrial equipment.
Sustainable & Heat-Stable
ISCC PLUS-certified bio-circular content meets ESG goals, while a 130°C Vicat rating ensures stability in high-heat environments like engine compartments.
Use & Applications
- Consumer Electronics: Smartphone cases, laptop housings.
- Automotive: Dashboard components, interior trim.
- Industrial: Power tool bodies, electrical connectors.
- Enclosures: Control panels, ruggedized equipment covers.