Sabic CYCOLOY™ FR Resins CY5025 PC/ABS
Plastic Granules
Sabic Cycoloy FR CY5025 (PC/ABS) Resin
Cycoloy Fr resins CY5025 Granules are a non-halogenated, flame-retardant PC/ABS blend. This injection-molding grade offers a UL94 V-0 rating and excellent flow, making it ideal for demanding thin-wall applications in electronics and more.
Associated Documents
TDS Asia
Typical property data
Physical Properties
- Density: 1.2 g/cm³ (ISO 1183)
- Mold Shrinkage:
- Flow: 0.23% (SABIC Method)
- Cross-flow: 0.31% (SABIC Method)
- Melt Flow Rate: 27 g/10 min (ASTM D1238)
- Water Absorption (23°C, saturated): 0.29% (ISO 62-1)
Mechanical Properties
- Tensile Stress (Yield): 57 MPa (ISO 527)
- Tensile Strain (Break): 99% (ISO 527)
- Flexural Stress (Yield): 96 MPa (ISO 178)
- Flexural Modulus: 2880 MPa (ISO 178)
Impact Properties
- Izod Impact, Notched (23°C): 450 J/m (ASTM D256)
- Charpy Impact Strength (23°C, V-notch): 11 kJ/m² (ISO 179/1eA)
Thermal Properties
- HDT (1.82 MPa): 72∘C (ASTM D648)
- HDT (0.45 MPa): 83∘C (ISO 75/Bf)
- Relative Temperature Index (RTI):
- Electrical: 60∘C (UL 746B)
- Mechanical with impact: 60∘C (UL 746B)
- Mechanical without impact: 60∘C (UL 746B)
Electrical Properties
- Surface Resistivity: 1.E+15 (ASTM D257)
- Comparative Tracking Index (CTI): PLC Code 0 (UL 746A)
Flame Characteristics
- UL Compliant Flame Ratings:
- UL 94V-1: 1.0 mm
- UL 94V-0: 1.2 mm
- UL 94-5VB: 1.5 mm
Injection Molding Parameters
- Drying Temperature: 80–90∘C
- Drying Time: 3–4 hours
- Maximum Moisture Content: 0.04%
- Melt Temperature: 245–275∘C
- Mold Temperature: 60–80∘C
- Screw Speed: 40–70 rpm
- Injection Pressure: 0.3–0.7 MPa
Features & Benefits
Superior Flame Retardancy Without Halogens
CYCOLOY FR Resins CY5025 meets strict UL94 V-0 and 5VB ratings without using chlorinated or brominated additives. This provides enhanced safety and helps you meet global environmental regulations for electronics.
Excellent Mechanical Strength and Toughness
This Cycoloy CY5025 resin balances high tensile strength and impact resistance. It ensures your thin-walled components can withstand physical stress and accidental drops during everyday use, improving product durability.
High Fluidity for Easy Processing
With a high melt flow rate, CYCOLOY CY5025 Granules fill intricate and thin-walled molds effortlessly. This results in faster cycle times, higher production efficiency, and excellent surface finish for your parts.
Use & Applications
- Thin-Wall Laptop Housings and Components
- Smartphone and Tablet Structural Parts
- Internal Chassis and Brackets for Consumer Electronics
- Electrical Connectors and Housings
- Components for Home Appliances