Plastic Granules
Invista™ U2501 Low Viscosity PA66 Resin
INVISTA™ U2501 PA66 Resin is a high-performance, low-viscosity, and high-flowability polyamide designed for compounding applications. Its unique formulation delivers superior mechanical integrity, thermal resilience, and exceptional flow properties, perfect for high-efficiency production.
Associated Documents
TDS - Data Sheet
Typical property data
Physical Properties
- Density: 1.14 g/cm³ (ISO 1183)
- Mold Shrinkage (2.0 mm, parallel): 1.3% (ISO 294-4)
- Mold Shrinkage (2.0 mm, transverse): 1.5% (ISO 294-4)
- Water Absorption (24 hours): 2.0% (ISO 62)
- Water Absorption (at equilibrium, 50% RH): 2.6% (ISO 62)
Mechanical Properties
- Tensile Strength (at yield): 82 MPa (ISO 527)
- Elongation (at yield): 4.5% (ISO 527)
- Elongation (at break): 9% (ISO 527)
- Tensile Modulus: 3000 MPa (ISO 527)
- Flexural Modulus: 2800 MPa (ISO 178)
- Flexural Strength: 116 MPa (ISO 178)
- Notched Charpy Impact Strength (23°C): 4.4 kJ/m² (ISO 179)
- Notched Charpy Impact Strength (-30°C): 4.3 kJ/m² (ISO 179)
- Unnotched Charpy Impact Strength (23°C): NB (No Break) (ISO 179)
- Unnotched Charpy Impact Strength (-30°C): 70 kJ/m² (ISO 179)
- Notched Izod Impact Strength (23°C): 3.7 kJ/m² (ISO 180)
Viscosity Properties
- Relative Viscosity (RV) in Formic Acid: ~25 (ASTM D789)
- Viscosity Number (VN) at 0.5% in Sulfuric Acid: ~100 mL/g (ISO 307)
- RV at 1% in Sulfuric Acid: ~2.1 (Modified ISO 307)
Thermal Properties
- Melting Temperature: 265°C (ISO 11357)
- Heat Deflection Temperature (HDT) at 0.45 MPa: 207°C (ISO 75)
- Heat Deflection Temperature (HDT) at 1.80 MPa: 73°C (ISO 75)
Injection Molding
- Drying Temperature: 80°C
- Drying Time: 10–16 hours
- Barrel Temperatures:
- Rear: 250–270°C
- Middle: 270–290°C
- Front: 270–290°C
- Nozzle: 270–290°C
- Processing Temperature (Melt): 280–295°C
- Mold Temperature: 50–90°C
- Back Pressure: 5–30 bar
- Vent Depth: 0.007–0.04 mm
- Cushion Range: 4–6 mm
- Suggested Moisture Content:
- Max: 0.20 wt%
- Min: 0.10 wt%
- Screw Speed: 50–150 rpm
Use & Applications
for compounding application