Invista™ U4300 Nylon66
Plastic Granules
Invista™ U4300 High Viscosity PA66 Resin
INVISTA™ U4300 is a high-performance, natural PA66 resin with exceptional flowability, optimized for compounding, injection molding, and extrusion applications. Its balanced properties, durability, and versatility make it the preferred choice across multiple industries.
Associated Documents
TDS - Data Sheet
Typical property data
Physical Properties
- Density: 1.14 g/cm³ (ISO 1183)
- Mold Shrinkage:
- Parallel (2 mm): 1.7% (ISO 294-4)
- Transverse (2 mm): 1.7% (ISO 294-4)
- Water Absorption:
- 24 hours: 1.8% (ISO 62)
- Equilibrium @ 50% RH: 2.6% (ISO 62)
Mechanical Properties
- Tensile Strength at Yield: 80 MPa (ISO 527)
- Elongation:
- At Yield: 4.4% (ISO 527)
- At Break: 30% (ISO 527)
- Tensile Modulus: 2950 MPa (ISO 527)
- Flexural Modulus: 2800 MPa (ISO 178)
- Flexural Strength: 91 MPa (ISO 178)
- Impact Strength (Charpy, Notched):
- At 23°C: 6.7 kJ/m² (ISO 179)
- At -30°C: 4.3 kJ/m² (ISO 179)
- Impact Strength (Charpy, Unnotched):
- At 23°C: No Break (NB) (ISO 179)
- At -30°C: 180 kJ/m² (ISO 179)
- Impact Strength (Izod, Notched) at 23°C: 4.9 kJ/m² (ISO 180)
Viscosity Properties
- Relative Viscosity (RV):
- In formic acid (nominal): 43 (ASTM D789)
- RV in sulfuric acid at 1% (nominal): 2.6 (Modified ISO 307)
- Viscosity Number (VN): 142 mL/g in sulfuric acid, 0.5% (ISO 307)
Thermal Properties
- Melting Temperature: 261°C (ISO 11357)
- Heat Deflection Temperature (HDT):
- At 0.45 MPa: 205°C (ISO 75)
- At 1.80 MPa: 67°C (ISO 75)
Injection Molding
- Drying Temperature: 80°C
- Drying Time: 3–4 hours
- Barrel Temperatures:
- Rear: 250–270°C
- Middle: 270–290°C
- Front: 270–290°C
- Nozzle: 270–295°C
- Processing Temperature (Melt): 280–295°C
- Mold Temperature: 50–90°C
- Back Pressure: 5–30 bar
- Vent Depth: 0.007–0.04 mm
- Cushion (Range): 4–6 mm
- Screw Speed: 50–150 rpm
- Maximum Suggested Moisture Content: 0.20 wt%
- Minimum Suggested Moisture Content: 0.10 wt%
Use & Applications
- for compounding, injection molding, and extrusion applications.