Plastic Granules
Invista™ U4500 Low Viscosity PA66 Resin
INVISTA™ U4500 is a general-purpose, natural PA66 resin designed for compounding, injection molding, and extrusion applications. With excellent flow characteristics, this material offers reliability in processing and optimal performance across various industries.
Associated Documents
TDS - Data Sheet
Typical property data
Physical Properties
- Density: 1.14 g/cm³ (ISO 1183)
- Mold shrinkage (2.0 mm, parallel): 1.6% (ISO 294-4)
- Mold shrinkage (2.0 mm, transverse): 1.8% (ISO 294-4)
- Water absorption (24 hours): 1.7% (ISO 62)
- Water absorption (equilibrium at 50% RH): 2.6% (ISO 62)
Mechanical Properties
- Tensile strength at yield: 83 MPa (ISO 527)
- Elongation at yield: 4.1% (ISO 527)
- Elongation at break: 40% (ISO 527)
- Tensile modulus: 3000 MPa (ISO 527)
- Flexural modulus: 3000 MPa (ISO 178)
- Flexural strength: 92 MPa (ISO 178)
- Notched Charpy impact strength at 23°C: 5.4 kJ/m² (ISO 179)
- Notched Charpy impact strength at -30°C: 4.2 kJ/m² (ISO 179)
- Unnotched Charpy impact strength at 23°C: NB (ISO 179)
- Unnotched Charpy impact strength at -30°C: 410 kJ/m² (ISO 179)
- Notched Izod Impact at 23°C: 4.9 kJ/m² (ISO 180)
Viscosity Properties
- Relative Viscosity (RV) in formic acid: 45 (ASTM D789)
- Viscosity Number (VN) at 0.5% in sulfuric acid: 145 mL/g (ISO 307)
- Relative Viscosity (RV) at 1% in sulfuric acid: 2.65 (Modified ISO 307)
Thermal Properties
- Melting temperature (10°C/min): 261°C (ISO 11357)
- HDT (Heat Deflection Temperature) at 0.45 MPa: 198°C (ISO 75)
- HDT at 1.80 MPa: 68°C (ISO 75)
Injection Molding
- Drying temperature: 80°C
- Drying time: 3–4 hours (initial moisture below 0.25 wt% required)
- Processing (melt) temperature: 280–295°C
- Mold temperature: 50–90°C
- Barrel temperatures:
- Rear: 250–270°C
- Middle: 270–290°C
- Front: 270–290°C
- Nozzle: 270–295°C
- Back pressure: 5–30 bar
- Vent depth: 0.007–0.04 mm
- Cushion (range): 4–6 mm
- Screw speed: 50–150 rpm
- Suggested moisture content: 0.10–0.20 wt%
Use & Applications
- for compounding, injection molding, and extrusion applications.