LG Chem ABS AP163
LG ABS AP163 General Grade High Antistatic
LG ABS AP163 is a premium, permanent anti-static ABS resin from LG Chem, specifically engineered for injection molding. It provides a consistent surface resistance of 10^12Ω, making it ideal for sensitive electronic applications like IC trays.
Associated Documents
ISO TDS
ASTM TDS
MSDS
UL Product iQ Yellow Card
Typical property data
Physical Properties
- Specific Gravity: 1.06 (ASTM D792)
- Mold Shrinkage: 0.4 ~ 0.7% (23°C, 3.2 mm, ASTM D955)
- Melt Flow Index: 30 g/10 min (220°C, 10 kg, ASTM D1238)
Mechanical Properties
- Tensile Strength at Yield: 41 MPa (23°C, 50 mm/min, 3.2 mm, ASTM D638)
- Tensile Elongation at Break: ≥10% (23°C, 50 mm/min, 3.2 mm, ASTM D638)
- Flexural Strength: 67 MPa (23°C, 10 mm/min, 6.4 mm, ASTM D790)
- Flexural Modulus: 2050 MPa (23°C, 10 mm/min, 6.4 mm, ASTM D790)
- Rockwell Hardness: R-Scale: 98 (ASTM D785)
Impact Properties
- Izod Impact Strength (Notched, 3.2 mm, 23°C): 440 J/m (ASTM D256)
- Izod Impact Strength (Notched, 6.4 mm, 23°C): 420 J/m (ASTM D256)
Thermal Properties
- Heat Deflection Temperature: 84°C (Edgewise, 1.82 MPa, 6.4 mm, unannealed, ASTM D648)
- Vicat Softening Temperature: 91°C (50 N, 50°C/h, ASTM D1525)
Processing Guide
- Drying Temperature: 70 ~ 80°C
- Drying Time: 3 ~ 4 hours
- Injection Temperature: 200 ~ 250°C
- Mold Temperature: 40 ~ 80°C
- Screw Speed: 30 ~ 60 rpm
Features & Benefits
Permanent Anti-Static Protection
LG Chem ABS AP163 integrates a permanent anti-static agent, eliminating dust attraction and preventing electrostatic discharge (ESD) that can damage delicate microchips and components during handling and shipping.
Superior Mechanical Toughness
This material offers excellent impact strength and rigidity, ensuring your IC trays and components are durable enough to withstand the rigors of automated assembly lines, repeated use, and transportation without cracking or breaking.
Optimized for Production Efficiency
With a high melt flow rate, AP163 allows for easy filling of complex molds and faster cycle times. Its wide processing window (200-250°C) provides flexibility and consistency for high-volume manufacturing.
Use & Applications
- Injection Molding of precision parts.
- IC Trays and carriers for integrated circuits, memory modules, and other electronic components.