LEXAN™ PC Resin 9925A

sabic pc resin

LEXAN™ Resin 9925A Flame Retardant Transparent PC

LEXAN™ Resin 9925A is a transparent flame-retardant PC resin. It uses a non-brominated and non-chlorinated FR system. It achieves UL 94 V-0 at 1.5 mm. It offers good flow with 13 g/10 min MFR. It supports thin-wall molding and WEEE/RoHS-focused applications.

Associated Documents

TDS - Data Sheet Asia
SDS - Safety Data Sheet

Typical property data

Physical Properties
  • Specific Gravity: 1.2 (ASTM D792)
  • Density: 1.2 g/cm³ (ISO 1183)
  • Mold Shrinkage, Flow, 3.2 mm: 0.5–0.7% (SABIC Method)
  • Melt Flow Rate, 300°C / 1.2 kgf: 13 g/10 min (ASTM D1238)
  • Water Absorption, 23°C / Saturation: 0.35% (ISO 62)
  • Moisture Absorption, 23°C / 50% RH: 0.15% (ISO 62)
Mechanical Properties
  • Tensile Stress at Yield, Type I, 50 mm/min: 60 MPa (ASTM D638)
  • Tensile Stress at Break, Type I, 50 mm/min: 60 MPa (ASTM D638)
  • Tensile Strain at Yield, Type I, 50 mm/min: 6% (ASTM D638)
  • Tensile Strain at Break, Type I, 50 mm/min: 83% (ASTM D638)
  • Tensile Modulus, 5 mm/min: 2300 MPa (ASTM D638)
  • Flexural Stress at Yield, 1.3 mm/min, 50 mm Span: 91 MPa (ASTM D790)
  • Flexural Modulus, 1.3 mm/min, 50 mm Span: 2150 MPa (ASTM D790)
  • Tensile Stress at Yield, 50 mm/min: 62 MPa (ISO 527)
  • Tensile Stress at Break, 50 mm/min: 56 MPa (ISO 527)
  • Tensile Strain at Yield, 50 mm/min: 6% (ISO 527)
  • Tensile Strain at Break, 50 mm/min: 77% (ISO 527)
  • Tensile Modulus, 1 mm/min: 2230 MPa (ISO 527)
  • Flexural Stress at Break, 12.5 mm/min: 95 MPa (ISO 178)
  • Flexural Modulus, 2 mm/min: 2240 MPa (ISO 178)
Impact Properties
  • Notched Izod Impact Strength, 23°C: 750 J/m (ASTM D256)
  • Instrumented Impact Total Energy, 23°C: 75 J (ASTM D3763)
  • Charpy Impact Strength, 23°C, V-Notch Edgewise, 80 × 10 × 3 mm, Span 62 mm: 68 kJ/m² (ISO 179/1eA)
Thermal Properties
  • Vicat Softening Temperature, Rate B/50: 140°C (ASTM D1525)
  • Heat Deflection Temperature, 1.82 MPa, 3.2 mm, Unannealed: 124°C (ASTM D648)
  • Coefficient of Thermal Expansion, -40°C to 40°C, Flow: 7.0 × 10⁻⁵ 1/°C (ASTM E831)
  • Coefficient of Thermal Expansion, -40°C to 40°C, Cross Flow: 7.0 × 10⁻⁵ 1/°C (ASTM E831)
  • HDT/Af, 1.8 MPa, Flatwise, 80 × 10 × 4 mm, Span 64 mm: 123°C (ISO 75/Af)
Flame Characteristics
  • UL Recognized Flame Class Rating: UL 94 V-0 at 1.5 mm (UL 94)
  • Flame Retardant System: Non-brominated and non-chlorinated
  • Thin-Wall FR Capability: Designed for thin-wall flame-retardant performance
Injection Molding Parameters
  • Drying Temperature: 120°C
  • Drying Time: 2–4 hrs
  • Maximum Moisture Content: 0.02%
  • Melt Temperature: 280–310°C
  • Nozzle Temperature: 270–290°C
  • Front / Zone 3 Temperature: 280–310°C
  • Middle / Zone 2 Temperature: 270–290°C
  • Rear / Zone 1 Temperature: 260–280°C
  • Hopper Temperature: 60–80°C
  • Mold Temperature: 80–110°C

Use & Applications

  • Transparent Electrical Housings
  • Thin-Wall Electronic Components
  • Lighting and LED Covers
  • Power Supply and Adapter Parts
  • Consumer Electronics Components
  • Transparent Industrial Covers
sabic pc resin 25kg package

Features & Benefits

UL 94 V-0 Flame Safety

LEXAN™ Resin 9925A achieves UL 94 V-0 at 1.5 mm, supporting safer thin-wall transparent PC part designs.

Halogen-Free FR System

LEXAN™ Resin 9925A uses non-brominated, non-chlorinated flame retardancy, helping buyers meet WEEE/RoHS-focused material requirements.

Balanced Flow and Toughness

With 13 g/10 min MFR and 750 J/m notched Izod impact, LEXAN™ Resin 9925A supports durable injection-molded parts.
lexan™ pc resin

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