SABIC® PC Resin PC0700

sabic pc resin

Sabic PC Resin PC0700 Compounding Grade

Sabic PC0700 is a heat-stabilized, low-flow polycarbonate. This base resin is engineered for custom compounding, offering a robust foundation for high-performance, durable applications.

Associated Documents

TDS Asia
TDS Americas
TDS Europe

Typical property data

Physical Properties
  • Specific Gravity: 1.2 (ASTM D792; ISO 1183)
  • Water Absorption (23°C, Saturated): 0.35% (ASTM D570; ISO 62-1)
  • Melt Flow Rate (300°C/1.2 kg): 7 g/10 min (ASTM D1238)
  • Melt Volume Rate (300°C/1.2 kg): 6 cm³/10 min (ISO 1133)
  • Mold Shrinkage (flow, 3.2 mm): 0.5–0.7% (SABIC method)
Mechanical Properties
  • Tensile Stress (yield, 50 mm/min): 63 MPa (ASTM D638; ISO 527)
  • Tensile Strain (yield, 50 mm/min): 6% (ASTM D638; ISO 527)
  • Tensile Strain (break, 50 mm/min): >70% (ASTM D638; ISO 527)
  • Tensile Modulus (50 mm/min): 2350 MPa (ASTM D638; ISO 527)
  • Flexural Stress (yield, 2 mm/min): 90 MPa (ASTM D790; ISO 178)
  • Flexural Modulus (2 mm/min): 2300 MPa (ASTM D790; ISO 178)
  • Hardness (Rockwell R): 120 (ASTM D785; ISO 2039-2)
Impact Properties
  • Izod Impact, Unnotched (23°C): NB (ASTM D4812)
  • Izod Impact, Notched (23°C): 900 J/m (ASTM D256)
  • Instrumented Dart Impact Energy (23°C): 65 J (ASTM D3763)
  • Izod Impact, Unnotched (ISO 180/1U, +23°C): NB
  • Izod Impact, Unnotched (ISO 180/1U, -30°C): NB
  • Izod Impact, Notched (ISO 180/1A, +23°C): 70 kJ/m²
  • Izod Impact, Notched (ISO 180/1A, -30°C): 12 kJ/m²
Thermal Properties
  • Vicat Softening Temperature (Rate B/50): 144°C (ASTM D1525; ISO 306)
  • HDT (0.45 MPa, 3.2 mm): 138°C (ASTM D648; ISO 75/Bf)
  • HDT (1.82 MPa, 3.2 mm): 127°C (ASTM D648; ISO 75/Af)
  • Coefficient of Thermal Expansion (CTE, Flow, -40°C to 95°C): 7.E-05 1/°C (ASTM E831)
  • Thermal Conductivity: 0.2 W/m-°C (ASTM C177; ISO 8302)
  • Ball Pressure Test (125°C): Pass (IEC 60695-10-2)
Optical Properties
  • Light Transmission (2.54 mm): 88–90% (ASTM D1003)
  • Haze (2.54 mm): <0.8% (ASTM D1003)
  • Refractive Index: 1.586 (ASTM D542; ISO 489)
Electrical Properties
  • Volume Resistivity: >1.E+15 Ω.cm (ASTM D257; IEC 60093)
  • Dielectric Strength (1.6 mm): 27 kV/mm (ASTM D149; IEC 60243-1)
  • Relative Permittivity (60 Hz): 3 (ASTM D150; IEC 60250)
  • Relative Permittivity (1 MHz): 3 (ASTM D150; IEC 60250)
  • Dissipation Factor (60 Hz): 0.001 (ASTM D150; IEC 60250)
  • Dissipation Factor (1 MHz): 0.01 (ASTM D150; IEC 60250)
Flame Characteristics

UL Flame Class Rating: UL 94 V-2 (1.5 mm)

Injection Molding
  • Drying Temperature: 120°C
  • Drying Time: 2–4 hours
  • Maximum Moisture Content: 0.02%
  • Melt Temperature: 290–320°C
  • Nozzle Temperature: 280–310°C
  • Front Zone Temperature: 290–320°C
  • Middle Zone Temperature: 280–310°C
  • Rear Zone Temperature: 270–300°C
  • Hopper Temperature: 60–80°C
  • Mold Temperature: 80–120°C

Features & Benefits

High Strength and Rigidity

Sabic PC0700 offers a tensile modulus of 2350 MPa, ensuring excellent structural integrity for durable, load-bearing components in demanding applications.

Exceptional Heat Resistance

With an HDT of 138°C at 0.45 MPa, this resin performs reliably under high-temperature conditions, ideal for automotive and electronics.

Superior Optical Transparency

Sabic PC0700 provides 88-90% light transmission with minimal haze, making it perfect for applications requiring clarity and premium aesthetics.

sabic pc resin

Use & Applications

  • Automotive
  • Consumer Electronics
  • Electrical
  • Construction
  • Medical Devices
sabic pc resin

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