SABIC® PC Resin PC2200
Plastic Granules
Sabic PC2200 Compounding Grade High-flow Heat-stabilized
Sabic PC2200 is a high-flow, heat-stabilized polycarbonate. It’s engineered as a versatile base resin for custom compounding, enabling you to create specialized, high-performance materials.
Typical property data
Physical Properties
- Specific Gravity: 1.2 (ASTM D792, ISO 1183)
- Water Absorption (23°C, Saturated): 0.35% (ASTM D570, ISO 62-1)
- Melt Flow Rate (300°C/1.2 kg): 22 g/10 min (ASTM D1238)
- Melt Volume Rate (300°C/1.2 kg): 21 cm³/10 min (ISO 1133)
Mechanical Properties
- Tensile Stress (Yield, 50 mm/min): 63 MPa (ASTM D638, ISO 527)
- Tensile Strain (Yield, 50 mm/min): 6% (ASTM D638, ISO 527)
- Tensile Strain (Break, 50 mm/min): >70% (ASTM D638, ISO 527)
- Tensile Modulus: 2350 MPa (ASTM D638, ISO 527)
- Flexural Stress (Yield, 1.3 mm/min): 90 MPa (ASTM D790, ISO 178)
- Flexural Modulus: 2300 MPa (ASTM D790, ISO 178)
- Hardness (Rockwell R): 120 (ASTM D785, ISO 2039-2)
Impact Properties
- Izod Impact Strength (Unnotched, 23°C): NB (No Break) (ASTM D4812, ISO 180/1U)
- Izod Impact Strength (Notched, 23°C): 640 J/m (ASTM D256); 65 kJ/m² (ISO 180/1A)
- Izod Impact Strength (Notched, -30°C): 12 kJ/m² (ISO 180/1A)
- Instrumented Dart Impact Energy (@ Peak, 23°C): 55 J (ASTM D3763)
Thermal Properties
- Vicat Softening Temperature (Rate B/50): 140°C (ASTM D1525, ISO 306)
- Heat Deflection Temperature (HDT, 0.45 MPa): 133°C (ASTM D648, ISO 75/Bf)
- Heat Deflection Temperature (HDT, 1.82 MPa): 122°C (ASTM D648, ISO 75/Af)
- Thermal Conductivity: 0.2 W/m-°C (ASTM C177, ISO 8302)
- Coefficient of Thermal Expansion (CTE, Flow, -40°C to 95°C): 7.E-05 1/°C (ASTM E831, ISO 11359-2)
Optical Properties
- Light Transmission (2.54 mm): 88–90% (ASTM D1003)
- Haze (2.54 mm): <0.8% (ASTM D1003)
- Refractive Index: 1.586 (ASTM D542, ISO 489)
Electrical Properties
- Volume Resistivity: >1.E+15 Ω.cm (ASTM D257, IEC 60093)
- Dielectric Strength (1.6 mm): 27 kV/mm (ASTM D149, IEC 60243-1)
- Relative Permittivity (60 Hz): 3 (ASTM D150, IEC 60250)
- Dissipation Factor (60 Hz): 0.001 (ASTM D150, IEC 60250)
Flame Characteristics
Flame Class Rating (1.5 mm): UL 94 V-2 (UL 94)
Injection Molding
- Drying Temperature: 120°C
- Drying Time: 2–4 hours
- Maximum Moisture Content: 0.02%
- Melt Temperature: 280–300°C
- Mold Temperature: 80–100°C
- Nozzle Temperature: 270–290°C
Features & Benefits
Exceptional High-Flow Molding
With an MFR of 22g/10min, Sabic PC2200 fills complex, thin-walled molds effortlessly. This results in faster cycle times and higher production yields, reducing your manufacturing costs per part.
Superior Impact Resistance & Toughness
This resin offers outstanding notched Izod impact strength. Your compounded products will be exceptionally durable, resisting cracks, breaks, and impact damage during use, which enhances product reliability.
Reliable Thermal Performance
Featuring a Heat Deflection Temperature of 122°C at 1.82 MPa, Sabic PC2200 maintains structural integrity under heat. It’s ideal for components that must perform reliably in elevated temperature environments.
Use & Applications
- Automotive Components
- Consumer Electronics Housings
- Electrical Enclosures and Connectors
- Industrial Parts and Equipment
- And other specialized applications requiring a high-flow, tough polycarbonate base.