XENOY™ Resin PC PBT HTX975

sabic xenoy pc pbt

XENOY™ Resin HTX975 PC PBT Resin 35% Glass Fiber Reinforced

XENOY™ Resin HTX975 is a 35% glass fiber reinforced PC/PBT resin. It offers high stiffness, 142 MPa tensile stress, and 201°C HDT at 1.8 MPa. It suits EV parts, grille shutters, and e-coating bake parts up to about 200°C.

Associated Documents

TDS - Americas

Typical property data

Physical Properties
  • Density: 1.62 g/cm³ (ISO 1183)
  • Mold Shrinkage, Flow, 3.2 mm: 0.4–0.6% (SABIC method)
  • Mold Shrinkage, Cross Flow, 3.2 mm: 0.6–0.8% (SABIC method)
  • Water Absorption, 23°C / Saturated: 0.26% (ISO 62-1)
  • Moisture Absorption, 23°C / 50% RH: 0.11% (ISO 62)
  • Melt Volume Rate, MVR at 265°C / 5.0 kg: 33 cm³/10 min (ISO 1133)
Mechanical Properties
  • Tensile Stress at Break, 5 mm/min: 142 MPa (ISO 527)
  • Tensile Strain at Break, 5 mm/min: 2.1% (ISO 527)
  • Tensile Modulus, 1 mm/min: 10500 MPa (ISO 527)
  • Flexural Stress at Break, 2 mm/min: 207 MPa (ISO 178)
  • Flexural Modulus, 2 mm/min: 10450 MPa (ISO 178)
Impact Properties
  • Izod Impact, Unnotched, 80 × 10 × 4 mm, +23°C: 47 kJ/m² (ISO 180/1U)
  • Izod Impact, Unnotched, 80 × 10 × 4 mm, -30°C: 47 kJ/m² (ISO 180/1U)
  • Izod Impact, Notched, 80 × 10 × 4 mm, +23°C: 8 kJ/m² (ISO 180/1A)
  • Izod Impact, Notched, 80 × 10 × 4 mm, -30°C: 8 kJ/m² (ISO 180/1A)
  • Charpy Impact, V-Notch Edgewise, -30°C, 80 × 10 × 4 mm, Span 62 mm: 9 kJ/m² (ISO 179/1eA)
Thermal Properties
  • Coefficient of Thermal Expansion, Flow, -40°C to 40°C: 2.10E-05 1/°C (ISO 11359-2)
  • Coefficient of Thermal Expansion, Cross Flow, -40°C to 40°C: 8.20E-05 1/°C (ISO 11359-2)
  • Vicat Softening Temperature, Rate A/120: 235°C (ISO 306)
  • Vicat Softening Temperature, Rate B/50: 215°C (ISO 306)
  • Heat Deflection Temperature, HDT/Bf, 0.45 MPa, Flatwise, 80 × 10 × 4 mm, Span 64 mm: 234°C (ISO 75/Bf)
  • Heat Deflection Temperature, HDT/Af, 1.8 MPa, Flatwise, 80 × 10 × 4 mm, Span 64 mm: 201°C (ISO 75/Af)
  • E-Coating Bake Resistance: Designed for injection molded parts exposed to baking processes up to about 200°C
Electrical Properties
  • Volume Resistivity: 5.90E+13 Ω·cm (ASTM D257)
  • Surface Resistivity: 2.88E+13 Ω (ASTM D257)
  • Dielectric Strength, in Oil, 0.8 mm: 30 kV/mm (ASTM D149)
  • Dielectric Strength, in Oil, 1.6 mm: 21 kV/mm (ASTM D149)
  • Dielectric Strength, in Oil, 3.2 mm: 16 kV/mm (ASTM D149)
Injection molding Processing
  • Drying Temperature: 135°C
  • Drying Time: 4–6 hrs
  • Drying Time, Cumulative: 12 hrs
  • Maximum Moisture Content: 0.02%
  • Melt Temperature: 270–280°C
  • Nozzle Temperature: 265–275°C
  • Front Zone 3 Temperature: 270–280°C
  • Middle Zone 2 Temperature: 260–270°C
  • Rear Zone 1 Temperature: 250–260°C
  • Hopper Temperature: 40–60°C
  • Mold Temperature: 40–65°C
  • Back Pressure: 0.3–0.7 MPa
  • Screw Speed: 50–80 rpm
  • Shot to Cylinder Size: 40–80%
  • Vent Depth: 0.025–0.038 mm

Use & Applications

  • EV components
  • Front-end modules
  • Grille opening reinforcements
  • Structural parts
  • Grille shutters
  • E-coating process parts
sabic xenoy pc pbt

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