Suke Plastics 3016NW PC/ABS
Plastic Granules
Suke 3016NW PC/ABS Resin Flame Retardant Grade
Suke 3016NW is a halogen-free, high-temperature-resistant PC/ABS resin engineered for demanding electronics and consumer goods. It combines superior flame safety (UL94 V0), exceptional impact strength, and easy processability—ideal for thin-walled, precision components requiring reliability and compliance.
Associated Documents
ASTM TDS
Typical property data
Physical Properties
- Density: 1.19 g/cm³ (ASTM D792, 23°C)
- Mold Shrinkage: 0.4–0.8% (ASTM D955, 2 mm)
Mechanical Properties
- Tensile Strength: 55 MPa (ASTM D638, 50 mm/min)
- Elongation at Break: 80% (ASTM D638, 50 mm/min)
- Flexural Strength: 90 MPa (ASTM D790, 2 mm/min)
- Flexural Modulus: 2200 MPa (ASTM D790, 2 mm/min)
Impact Properties
- Izod Notched Impact Strength: 65 kJ/m² (ASTM D256, 3.2 mm, 23°C)
Thermal Properties
- Heat Distortion Temperature: 100°C (ASTM D648, 1.8 MPa, 6.4 mm)
Flame Characteristics
- Flammability: V0 at 1.5 mm thickness (UL94)
Injection Molding
- Pre-drying Condition: 90–95°C for 3 hours
- Injection Pressure: 60–100 MPa
- Mold Temperature: 90°C
- Melt Temperature: 270°C
- Maximum Processing Temperature: 290°C
Features & Benefits
Halogen-Free Safety
It meets strict environmental and safety standards (UL94 V0 at 1.5mm), ensuring safer end-products for electronics and wearables. No toxic fumes, no compromises.
Heat Resistance Stability
It withstands 100°C under load (HDT), preventing deformation in high-heat environments like charging ports or device housings. Durable under stress.
Impact-Ready Toughness
65 KJ/m² notched IZOD impact strength resists cracks/drops—perfect for portable devices (e.g., Bluetooth headsets, tablets). Built to last.
Use & Applications
- Electrical & Electronics: Housings, connectors, sockets.
- Office Supplies: Printer components, durable casings.
- Bluetooth Headsets: Lightweight, crack-resistant frames.
- Tablets & Portable Devices: Thin-wall structural parts.
