Plastic Granules
Suke D555 PC/ABS Resin General Purpose Grade
Suke D555 PC/ABS Resin is a high-performance, general-purpose grade engineered for exceptional all-around properties. Combining polycarbonate’s toughness with ABS’s processability, it delivers reliability for demanding industrial applications—ideal for cost-effective, durable components.
Associated Documents
ASTM TDS
Typical property data
Physical Properties
- Density: 1.10 g/cm³ (ASTM D792, at 23°C)
- Mold Shrinkage: 0.4–0.7% (Internal Standard, 2mm)
Mechanical Properties
- Tensile Strength: 48 MPa (ASTM D638, 50mm/min)
- Elongation at Break: 40% (ASTM D638, 50mm/min)
- Flexural Strength: 72 MPa (ASTM D790, 2mm/min)
- Flexural Modulus: 2000 MPa (ASTM D790, 2mm/min)
Impact Properties
Impact Strength (Notched Izod): 50 kJ/m² (ASTM D256, 3.2mm, 23°C)
Thermal Properties
Heat Distortion Temperature (HDT): 92°C (ASTM D648, 1.8MPa, 3.2mm)
Flame Characteristics
Flammability Rating: UL94 Class (3.2mm thickness)
Injection Molding
- Pre-drying Temperature: 85–95°C for 3 hours
- Injection Pressure: 60–100 MPa
- Injection Speed: 50–80 (no units specified)
- Mold Temperature: 80°C
- Processing Temperature (Max): 270°C
- Melt Temperature: 250°C
- Cylinder Temperature:
- Feeding Zone: 220–240°C
- Compression Zone: 230–250°C
- Nozzle Zone: 240–260°C
Features & Benefits
Balanced Strength & Flexibility
Suke D555 offers tensile strength (48 MPa) and high elongation (40%), preventing cracks in stressed parts like tool housings or snap-fit connectors under impact.
Effortless Molding & Stability
With low mold shrinkage (0.4–0.7%) and smooth flow (MFR 21 g/10min), it ensures dimensional accuracy for complex parts like thin-walled electronics casings.
Heat & Load Resilience
It resists deformation up to 92°C (HDT 1.8MPa), perfect for office equipment near motors or printers requiring thermal stability.
Use & Applications
- Electrical & Electronic: Power tool housings, connectors, circuit breakers.
- Office Supplies: Printer frames, keyboard components, ergonomic device casings.