Plastic Granules
ULTEM™ Resin 3473 Glass-fiber Reinforced PEI+PPS Blend
ULTEM™ Resin 3473 is a glass-fiber reinforced PEI+PPS blend engineered to combine amorphous and semi-crystalline performance. It delivers reliable metallization, SMT lead-free reflow solder capability, and extreme dimensional stability at elevated temperatures — a lightweight, RoHS-compliant, easy-flowing alternative to aluminum in electrical and industrial applications.
Associated Documents
TDS - Global
Typical property data
Physical Properties
- Density: 1.68 g/cm³ (ISO 1183)
- Melt Volume Rate (320°C / 5.0 kg): 5.5 cm³/10 min (ISO 1133)
- Mold Shrinkage, flow: 0.2 – 0.3 % (SABIC method)
- Mold Shrinkage, xflow: 0.3 – 0.4 % (SABIC method)
Mechanical Properties
- Tensile Stress at Break, Type I, 5 mm/min: 156 MPa (ASTM D638)
- Tensile Strain at Break, Type I, 5 mm/min: 1.8 % (ASTM D638)
- Tensile Modulus, 5 mm/min: 15,800 MPa (ASTM D638)
- Flexural Strength, 1.3 mm/min, 50 mm span: 231 MPa (ASTM D790)
- Flexural Modulus, 1.3 mm/min, 50 mm span: 14,500 MPa (ASTM D790)
- Tensile Stress at Break, 5 mm/min: 146 MPa (ISO 527)
- Tensile Strain at Break, 5 mm/min: 1.65 % (ISO 527)
- Tensile Modulus, 1 mm/min: 15,900 MPa (ISO 527)
- Flexural Strength, 2 mm/min: 201 MPa (ISO 178)
- Flexural Modulus, 2 mm/min: 14,500 MPa (ISO 178)
- Izod Impact, notched, 23°C: 56 J/m (ASTM D256)
- Izod Impact, unnotched, 23°C: 390 J/m (ASTM D4812)
- Izod Impact, notched (80×10×4), +23°C: 6.5 kJ/m² (ISO 180/1A)
- Izod Impact, unnotched (80×10×4), +23°C: 17.3 kJ/m² (ISO 180/1U)
Thermal Properties
- HDT, 0.45 MPa, 3.2 mm, unannealed: 275 °C (ASTM D648)
- HDT, 1.82 MPa, 3.2 mm, unannealed: 249 °C (ASTM D648)
- HDT/Bf, 0.45 MPa, Flatwise 80×10×4, sp=64 mm: 275 °C (ISO 75/Bf)
- HDT/Af, 1.8 MPa, Flatwise 80×10×4, sp=64 mm: 250 °C (ISO 75/Af)
- CTE, -40°C to 150°C, flow: 1.9 × 10⁻⁵ 1/°C (ISO 11359-2)
- CTE, -40°C to 150°C, xflow: 2.5 × 10⁻⁵ 1/°C (ISO 11359-2)
Electrical Properties
- Dielectric Constant, 1.9 GHz: 4.25 (SABIC method)
- Dielectric Constant, 5 GHz: 4.2 (SABIC method)
- Dissipation Factor, 1.9 GHz: 0.0056 (SABIC method)
- Dissipation Factor, 5 GHz: 0.0063 (SABIC method)
Injection Molding Processing
- Drying Temperature: 150 °C
- Drying Time: 4 – 6 Hrs
- Drying Time (Cumulative): 24 Hrs
- Maximum Moisture Content: 0.02 %
- Melt Temperature: 315 – 335 °C
- Nozzle Temperature: 300 – 335 °C
- Front / Zone 3 Temperature: 290 – 335 °C
- Middle / Zone 2 Temperature: 280 – 325 °C
- Rear / Zone 1 Temperature: 270 – 315 °C
- Mold Temperature: 120 – 180 °C
- Back Pressure: 0.3 – 0.7 MPa
- Screw Speed: 40 – 70 rpm
Use & Applications
- Industrial electrical components