
LG ABS ER468 Heat Resistant Grade
LG ABS ER468 is a heat-resistant ABS resin engineered for injection molding. It delivers an optimal balance of medium heat resistance and high flow, ensuring excellent processability and durable performance for a wide range of technical applications.
- Character: Medium Heat Resistance, High Flow
- Application: Electrical/Electronic Products, Miscellaneous Goods.
Key technical data (ASTM)
- Heat Deflection Temperature (HDT): 92 °C @ 1.82 MPa
- Melt Flow Rate (MFR): 35 g/10min (220°C/10kg)
- Tensile Strength at Yield: 44 MPa
- Flexural Modulus: 2,400 MPa
- Izod Impact (Notched): 300 J/m @ 3.2mm thickness
- Flammability Rating: UL 94 HB @ 1.5mm and 3.0mm
- Mold Shrinkage: 0.4 – 0.7 %
Application
- Electrical/Electronic Products: Housings for power adapters, office equipment, console enclosures, and internal components.
- Miscellaneous Goods: Durable consumer goods, appliance parts, automotive interior trim, and functional components requiring a balance of strength and heat resistance.
Features & Benefits

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