SABIC® PC Resin PC0800

Sabic PC Resin PC0800 General Purpose Grade

Sabic PC0800 is a heat-stabilized, low-flow polycarbonate. This base resin is engineered for custom compounding, offering excellent mechanical strength, high heat resistance, and superb impact performance for demanding applications.

Character: low flow (MFR = 8 at 300°C/1.2kg), heat stabilized

PC Resin

Sabic® PC Resin

Key technical data

Tensile Stress at Yield: 63 MPa
Flexural Modulus: 2300 MPa
Izod Impact, Notched: 900 J/m (ASTM)
Heat Deflection Temp (HDT) @ 1.82 MPa: 127°C
Vicat Softening Temperature: 144°C
Melt Flow Rate (300°C/1.2kg): 8 g/10 min
Mold Shrinkage, Flow: 0.5 – 0.7%
Specific Gravity: 1.2
Volume Resistivity: >1.E+15 Ω·cm
Dielectric Strength: 27 kV/mm

Download

SABIC® PC0800 Americas TDS Download

SABIC® PC Resin PC0800 Asia TDS Download

SABIC® PC Resin PC0800 Europe TDS Download

Application

Automotive interior and under-hood components
Electrical connectors and housings
Industrial machinery parts and covers
Consumer appliance housings and structural parts
Various custom-compounded plastic products

Features & Benefits

Exceptional Strength & Stiffness

With high tensile and flexural modulus, this Sabic PC0800 resin creates durable components that resist deformation under load, ensuring long-term structural integrity.

Superior Impact Resistance

Its excellent notched Izod impact strength means your products can withstand sudden shocks and drops without cracking, reducing failure rates and enhancing safety.

High Heat Resistance

With a Heat Deflection Temperature of 127°C at 1.82 MPa, parts made from this resin maintain their shape and performance in high-temperature environments.