SABIC® PC Resin PC2200

Sabic PC Resin PC2200 Compounding Grade

Sabic PC2200 is a high-flow, heat-stabilized polycarbonate. It’s engineered as a versatile base resin for custom compounding, enabling you to create specialized, high-performance materials.

Character: high flow (MFR = 22 at 300°C/1.2kg), heat stabilized

PC Resin

Sabic® PC Resin

Key technical data

Tensile Stress at Yield: 63 MPa
Flexural Modulus: 2300 MPa
Notched Izod Impact (23°C): 640 J/m (ASTM)
Heat Deflection Temp (HDT) @ 1.82 MPa: 122 °C
Vicat Softening Temperature: 140 °C
Melt Flow Rate (300°C/1.2kg): 22 g/10min
Specific Gravity: 1.2
Mold Shrinkage, Flow: 0.5 – 0.7%
UL 94 Flame Class Rating: V-2 at 1.6mm
Volume Resistivity: >1E+15 Ω·cm

Download

SABIC® PC2200 Americas TDS Download

SABIC® PC2200 Asia TDS Download

SABIC® PC2200 Europe TDS Download

Application

Automotive Components
Consumer Electronics Housings
Electrical Enclosures and Connectors
Industrial Parts and Equipment
And other specialized applications requiring a high-flow, tough polycarbonate base.

Features & Benefits

Exceptional High-Flow Molding

With an MFR of 22g/10min, Sabic PC2200 fills complex, thin-walled molds effortlessly. This results in faster cycle times and higher production yields, reducing your manufacturing costs per part.

Superior Impact Resistance & Toughness

This resin offers outstanding notched Izod impact strength. Your compounded products will be exceptionally durable, resisting cracks, breaks, and impact damage during use, which enhances product reliability.

Reliable Thermal Performance

Featuring a Heat Deflection Temperature of 122°C at 1.82 MPa, Sabic PC2200 maintains structural integrity under heat. It’s ideal for components that must perform reliably in elevated temperature environments.