Sabic LEXAN™ PC Resin EX9332T

sabic pc resin 25kg package

SABIC Lexan EX9332T high-viscosity

LEXAN™ Resin EX9332T is a high-viscosity, branched polycarbonate engineered for demanding extrusion applications. It combines inherent flame retardancy, UV stabilization, and excellent impact resistance, making it an ideal, durable material for critical sectors like railway systems and architectural construction, where long-term performance and safety are paramount.

Associated Documents

TDS Europe

Typical property data

Physical Properties
  • Mold Shrinkage (flow): 0.4 – 0.6 % (SABIC method)
  • Density: 1.25 g/cm³ (ISO 1183)
  • Water Absorption (23°C, saturated): 0.32 % (ISO 62-1)
  • Moisture Absorption (23°C/50% RH): 0.13 % (ISO 62)
  • Melt Flow Rate (MVR at 300°C/1.2 kg): 3 cm³/10 min (ISO 1133)
  • Melt Flow Rate (MVR at 300°C/2.16 kg): 5 cm³/10 min (ISO 1133)
Mechanical Properties
  • Taber Abrasion (1 kg, CS-17): 9 mg/1000 cycles (SABIC method)
  • Tensile Stress at Yield (50 mm/min): 65 MPa (ISO 527)
  • Tensile Stress at Break (50 mm/min): 70 MPa (ISO 527)
  • Tensile Strain at Yield (50 mm/min): 7 % (ISO 527)
  • Tensile Strain at Break (50 mm/min): >70 % (ISO 527)
  • Tensile Modulus: 2350 MPa (ISO 527)
  • Flexural Stress at Yield: 95 MPa (ISO 178)
  • Flexural Modulus: 2350 MPa (ISO 178)
  • Ball Indentation Hardness: 95 MPa (ISO 2039-1)
Impact Properties
  • Izod, Unnotched (+23°C): NB (No Break) (ISO 180/1U)
  • Izod, Unnotched (-30°C): NB (ISO 180/1U)
  • Izod, Notched (+23°C): 11 kJ/m² (ISO 180/1A)
  • Izod, Notched (-30°C): 10 kJ/m² (ISO 180/1A)
  • Charpy, Unnotched (+23°C): NB (ISO 179/1eU)
  • Charpy, Unnotched (-30°C): NB (ISO 179/1eU)
  • Charpy, Notched (+23°C): 11 kJ/m² (ISO 179/1eA)
  • Charpy, Notched (-30°C): 10 kJ/m² (ISO 179/1eA)
Thermal Properties
  • Thermal Conductivity: 0.2 W/m°C (ISO 8302)
  • Coefficient of Thermal Expansion (23°C – 80°C, flow): 7.E-05 1/°C (ISO 11359-2)
  • Vicat Softening Temp B/50: 155 °C (ISO 306)
  • Vicat Softening Temp B/120: 156 °C (ISO 306)
  • HDT (0.45 MPa): 148 °C (ISO 75/Be)
  • HDT (1.8 MPa): 135 °C (ISO 75/Ae)
  • Ball Pressure Test (125°C): Passes (IEC 60695-10-2)
  • Relative Thermal Index (Electrical, Mechanical): 80 °C (UL 746B)
Optical Properties
  • Light Transmission (2.54 mm): 88 % (ASTM D1003)
  • Haze (2.54 mm): <0.8 % (ASTM D1003)
  • Refractive Index: 1.586 (ISO 489)
Electrical Properties
  • Volume Resistivity: >1.E+15 Ω.cm (IEC 60093)
  • Surface Resistivity: >1.E+15 Ω (IEC 60093)
  • Dielectric Strength (3.2 mm in oil): 17 kV/mm (IEC 60243-1)
  • Relative Permittivity (50/60 Hz and 1 MHz): 2.7 (IEC 60250)
  • Dissipation Factor (50/60 Hz): 0.001 (IEC 60250)
  • Dissipation Factor (1 MHz): 0.01 (IEC 60250)
Flame Characteristics
  • Flame Class Rating (1.5 mm): UL 94 V-0 (UL 94)
  • Glow Wire Flammability Index (1 mm): Pass at 850°C (IEC 60695-2-12)
  • Glow Wire Flammability Index (960°C): Pass at 1 mm (IEC 60695-2-12)
  • Glow Wire Ignitability Temperature (2.5 mm): 850°C (IEC 60695-2-13)
  • Oxygen Index (LOI): 37 % (ISO 4589)
Injection Molding Recommendations
  • Drying Temperature: 120 °C
  • Drying Time: 2 – 4 hours
  • Barrel Zone Temperature: 260 – 300 °C
  • Hopper Temperature: 100 – 120 °C
  • Adapter Temperature: 240 – 280 °C
  • Die Temperature: 240 – 300 °C
  • Melt Temperature: 260 – 300 °C
  • Calibrator Temperature: 50 – 100 °C

Features & Benefits

Inherent Flame Retardancy & Safety

LEXAN EX9332T achieves a UL 94 V-0 rating, providing critical fire safety for public transport and buildings, reducing risk and helping meet stringent regulatory requirements.

Exceptional Toughness & Durability

Its superior impact resistance, even at -30°C, ensures components resist cracking and vandalism, delivering long service life and reliability in demanding outdoor and structural applications.

Weatherability & Dimensional Stability

UV-stabilized formulation protects against yellowing and degradation from sunlight, while low moisture absorption and a consistent CTE ensure parts maintain their shape and fit over time.

sabic pc resin 25kg package

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