Sabic LEXAN™ PC Resin LUX1619

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SABIC Lexan LUX1619 Flame Retardant Grade

LEXAN™ LUX1619 resin is a 7.5 MFR polycarbonate. UL94 HB rated. For high light reflectance. Extrudable and injection moldable.

Associated Documents

TDS Americas

Typical property data

Physical Properties
  • Specific Gravity: 1.34 (ASTM D792)
  • Melt Flow Rate: 7.5 g/10 min at 300°C/1.2 kgf (ASTM D1238)
  • Density: 1.34 g/cm³ (ISO 1183)
  • Water Absorption (23°C, saturated): 0.35% (ISO 62-1)
  • Moisture Absorption (23°C, 50% RH): 0.15% (ISO 62)
  • Mold Shrinkage (Flow, 3.2 mm): 0.8–1% (SABIC method)
Mechanical Properties
  • Tensile Stress at Yield: 57 MPa, Type I, 50 mm/min (ASTM D638)
  • Tensile Stress at Break: 50 MPa, Type I, 50 mm/min (ASTM D638)
  • Tensile Strain at Yield: 6%, Type I, 50 mm/min (ASTM D638)
  • Tensile Strain at Break: 74%, Type I, 50 mm/min (ASTM D638)
  • Flexural Stress at Yield: 97 MPa, 1.3 mm/min, 50 mm span (ASTM D790)
  • Flexural Modulus: 2730 MPa, 1.3 mm/min, 50 mm span (ASTM D790)
Impact Properties
  • Izod Impact (Unnotched, 23°C): 2130 J/m (ASTM D4812)
  • Izod Impact (Notched, 23°C): 640 J/m (ASTM D256)
  • Izod Impact (Notched, -30°C): 135 J/m (ASTM D256)
  • Instrumented Dart Impact Total Energy (23°C): 69 J (ASTM D3763)
Thermal Properties
  • Vicat Softening Temperature (Rate B/50): 147°C (ASTM D1525)
  • HDT (0.45 MPa, 3.2 mm, Unannealed): 141°C (ASTM D648)
  • HDT (1.82 MPa, 3.2 mm, Unannealed): 129°C (ASTM D648)
  • Coefficient of Thermal Expansion (Flow): 6.1E-05 1/°C (ASTM E831)
  • Coefficient of Thermal Expansion (Cross-flow): 6.4E-05 1/°C (ASTM E831)
Flame Characteristics
  • UL Flammability Class (94HB): Rated at 1.5 mm (UL 94)
  • Glow Wire Flammability Index: 960°C, passes at 1.5–3 mm (IEC 60695-2-12)
  • Glow Wire Ignitability Temperature (1.5 mm): 850°C (IEC 60695-2-13)
  • Glow Wire Ignitability Temperature (3.0 mm): 850°C (IEC 60695-2-13)
Injection Molding
  • Drying Temperature: 120°C
  • Drying Time: 3–4 hours
  • Maximum Moisture Content: 0.02%
  • Melt Temperature: 310–330°C
  • Nozzle Temperature: 305–325°C
  • Mold Temperature: 80–115°C
  • Back Pressure: 0.3–0.7 MPa
  • Screw Speed: 40–70 rpm
  • Shot to Cylinder Size: 40–60%
  • Vent Depth: 0.025–0.076 mm

Features & Benefits

High Light Reflectance

It can deliver superior brightness and diffusion, ideal for LED housings, backlit panels, and reflective lighting components.

Versatile Processing Options

Easily extrudable and injection moldable, allowing flexibility in part design and manufacturing across various production lines.

Dependable Thermal Stability

It can perform reliably at elevated temperatures (up to 125°C), suitable for demanding environments like enclosed lighting or electronic housings.

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